Goma Disipadora 0.5mm (Thermal pad) 3.0W/mK

Goma Disipadora 0.5mm (Thermal pad) 3.0W/mK

TH3001
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Junta solida termica que permita trasmitir el calor al disipador.

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$80.01
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Los GPUs y algunos CPUs en lugar de pasta termica necesitan de una junta solida termica que permita trasmitir el calor al disipador.
Medidas:
100x100mm x 0.5mm 
  • Conductividad térmica: 3.0W/mK
  • Temp.:-40C ~ 220C
  • Prueba De tensión: > $ NUMBER KV
  • dureza: 65±5°
  • suave, con un poco de viscosidad
  • buena conducción de calor, muy buena maleabilidad
: TH3001
Hurry! only 5 items left in stock.
Nuevo

Ficha técnica

Altura
10cm
Ancho
10cm
Largo
2cm
Peso (Kg)
5g
F_ClaveProdServ
32131008
F_ClaveUnidad
H87
F_Unidad
Pieza

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