Goma Disipadora 1.5mm (Thermal pad) 3.0W/mK

Goma Disipadora 1.5mm (Thermal pad) 3.0W/mK

TH3003
Nuevo

Junta solida termica que permita trasmitir el calor al disipador.

block Out Of Stock
Out of Stock
$175.00
IVA incluido
Cantidad

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Los GPUs y algunos CPUs en lugar de pasta termica necesitan de una junta solida termica que permita trasmitir el calor al disipador.

Medidas:
100x100mm x 1.5mm
Conductividad térmica: 3.0W/mK
Temp.:-40C ~ 220C
Prueba De tensión: > $ NUMBER KV
dureza: 65±5°
suave, con un poco de viscosidad
buena conducción de calor, muy buena maleabilidad

: TH3003
Out of Stock
Nuevo

Ficha técnica

Altura
10cm
Ancho
10cm
Largo
2cm
Peso (Kg)
5g
F_ClaveProdServ
32131008
F_ClaveUnidad
H87
F_Unidad
Pieza

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